| Mfg Part Number: AM2147-70DC | Alternate P/N: AM214770DC | NSN : 5962-01-130-3405 |
| NIIN : 011303405 | CAGE Code : 34335 | Manufacturer: Advanced Micro Devices Inc |
| Item Name : Microcircuitmemory | FSC : 5962 Microcircuits Electronic |
Thank you for your continued interest in AM2147-70DC under NSN 5962-01-130-3405 components available for purchase on Integrated Plane Parts. The Microcircuitmemory item associated with the part number AM2147-70DC, manufactured by Advanced Micro Devices Inc, is currently available on our database; as such, we ask that you please fill out and submit an Instant RFQ form detailing your requirements on parts needed. Details should include desired quantities, target prices, expected shipping time frames, and more, as applicable. Upon receipt of a completed form of AM2147-70DC, our representatives will harness your provided information and formulate a solution which satisfies your operational needs in just 15 minutes or less.
With our global supply chain stretching across the United States, Canada, and the United Kingdom, Integrated Plane Parts can provide expedited shipping on select orders for entities facing an Aircraft on Ground (AOG) situation or a variety of additional unique time constraints.
Operating with a strict NO CHINA SOURCING pledge, all orders are shipped alongside their manufacturer trace documentation or qualifying certifications, ensuring that customers can feel confident in every purchase made. With cost savings and rapid lead times bolstering every order, experience all we have to offer by submitting your RFQ for NSN 5962-01-130-3405 items under FSC 5962 Microcircuits Electronic with the CAGE Code 34335 by Advanced Micro Devices Inc, today!
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-130-3405 Item Description: Microcircuit Memory | 5962 | 011303405 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Am2147-70dc | 3 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAT | BODY WIDTH | 0.265 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.2 WATTS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND HIGH PERFORMANCE AND HIGH SPEED AND 3-STATE OUTPUT |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQZP | INPUT CIRCUIT PATTERN | 15 INPUT |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| ADAQ | BODY LENGTH | 0.880 INCHES MINIMUM AND 0.920 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.165 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | +0.0/+70.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQWX | OUTPUT LOGIC FORM | METAL OXIDE-SEMICONDUCTOR LOGIC |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -3.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | RAM |
| TTQY | TERMINAL TYPE AND QUANTITY | 18 PRINTED CIRCUIT |
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