| Mfg Part Number: MM5330J 883C | Alternate P/N: MM5330J883C | NSN : 5962-01-033-0746 |
| NIIN : 010330746 | CAGE Code : 50364 | Manufacturer: Mmi Amd |
| Item Name : Microcircuit Memory | FSC : 5962 Microcircuits Electronic |
Thank you for your continued interest in MM5330J 883C under NSN 5962-01-033-0746 components available for purchase on Integrated Plane Parts. The Microcircuit Memory item associated with the part number MM5330J 883C, manufactured by Mmi Amd, is currently available on our database; as such, we ask that you please fill out and submit an Instant RFQ form detailing your requirements on parts needed. Details should include desired quantities, target prices, expected shipping time frames, and more, as applicable. Upon receipt of a completed form of MM5330J 883C, our representatives will harness your provided information and formulate a solution which satisfies your operational needs in just 15 minutes or less.
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Operating with a strict NO CHINA SOURCING pledge, all orders are shipped alongside their manufacturer trace documentation or qualifying certifications, ensuring that customers can feel confident in every purchase made. With cost savings and rapid lead times bolstering every order, experience all we have to offer by submitting your RFQ for NSN 5962-01-033-0746 items under FSC 5962 Microcircuits Electronic with the CAGE Code 50364 by Mmi Amd, today!
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-033-0746 Item Description: Microcircuit Memory | 5962 | 010330746 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | U | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Mm5330j 883c | 2 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.896 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| AGAV | END ITEM IDENTIFICATION | BLDG BLOCK 57 FSCM 30003 |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQZP | INPUT CIRCUIT PATTERN | 6 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEQ | TIME RATING PER CHACTERISTIC | 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 625.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND PROGRAMMABLE AND PROGRAMMED AND BIPOLAR AND W/BUFFERED OUTPUT AND W/DECODED OUTPUT AND EXPANDABLE AND HIGH SPEED AND WIRE-OR OUTPUTS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-2 MIL-M-38510 |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 06424-10842 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWIN |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
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